Introduction:
SMT PCB Assembly means Surface Mount Technology, known as a a kind of Circuit assembly technology that installs the SMC/SMD (named Chip Components in Chinese) on the surface of Printed Circuit Board or on the surface of other substrates, which is solded and assembled by means of reflow soldering or dip soldering. It realizes high density, high reliability, miniaturization and low cost of electronic product assembly.
Characterictics:
1. High density, small size, low weight;
2. Reliable, strong earthquake resistance and low defect rate of soldering spot;
3. High frequency, reducting the interference of electromagnetism and radio frequency;
4. Easy to realize automation and improve production efficiency.
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Layer | Board Material | Board Thickness | Surface Treatment | The Min Space | The Min Line Width | The Min Hole | Remarks | |
01 | 6L | FR4-TG170 | 1.6MM | Immersion Gold 3U" | 4mil | 4mil | 8mil | |
02 | 6L | FR4-TG170 | 1.6MM | Immersion Gold 3U" | 4mil | 4mil | 8mil | |
03 | 8L | FR4-TG170 | 1.6MM | Immersion Gold 2U" | 4mil | 4mil | 8mil | |
04 | 6L | FR4 | 1.6MM | ENIG | 3mil | 4mil | 0.2mil |
Solermask Bridge3mil Laser Drilling 0.1mm |
05 | 4L | ROGERS+FR4混压 | 1.0MM | Immersion Gold 2U" | 4mil | 4mil | 8mil | High Frequency & Mixed Plating |
06 | 6L | FR4 | 1.6MM | OSP+Gold Finger | 4mil | 4mil | 0.25mil | Depth Control Holes |
07 | 12L | FR4 | 2.0MM | ENIG | 3mil | 3mil | 0.2mil |
Laser Drilling 0.1mm Impedance Control |
08 | 14L | FR4-TG170 | 8MM | Plating thick gold 3U" | 4mil | 4mil | 8mil | Half Hole Board |
09 | 4L | FR4-TG170 | 1.6MM | Immersion Gold | 4mil | 4mil | 8mil | High Frequency & Mixed Plating |