30L FR4 SMT PCB Компоненты толщиной 7,0 мм HASL 94v0-SHENZHEN KINGSUM CIRCUIT TECHNOLOGY CO., LTD

30L FR4 SMT PCB Компоненты толщиной 7,0 мм HASL 94v0

Минимальное количество заказов:	1 Д - 1
Детали упаковки:	Вакуумная упаковка
Время поставки:	3 - 14 дней
Условия оплаты:	Телеграфные переводы, переводы & lt; & lt; Вестерн Юнион & gt; & gt;, срочные переводы, аккредитивы, акцептные документы
Потенциал предложения:	2000 м2 / месяц

Detailed Product Description

Layer Count:	2 ` 30 Layers	Max Board Size:	600 Mm X 1200 Mm
Base Material For PCB:	FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material	Rang Of Finish Baords Thickness:	0.21-7.0mm
Minimum Line Width:	3mil (0.075mm)	Minimum Line Space:	3mil (0.075mm)
Minimum Hole Diameter:	0.10 Mm	E-Testing:	100% E-Testing (High Voltage Testing); Flying Probe Testing
High Light:	30L FR4 SMT PCB Assembly, SMT PCB Assembly 7.0mm Thickness, Lead Free HASL Pcb Prototype Board

Ultrafast PCB fabrication manufacturer, offering one-stop PCB manufacturing, PCB assembly, SMT stencil,cheap and good quality pcb smt assembly

1. Features

1. One Stop OEM Service, PCB manufacturing Made in Shenzhen of China

2. Manufactured by Gerber File and BOM List from Customer

3. FR4 Material, Meet 94V0 standard

4. SMT, DIP technology suport

5. Lead Free HASL, Environmental Protection

6. UL, CE, ROHS Compliant

7. Shipping By DHL,UPS, TNT, EMS or Customer requirement

2. PCB Technical capability

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
	Air bladder rate:less than20%
Press-fit	Press range:0-50KN
Press-fit	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling

3.PCB Manufacturing Process

4.The PCB Fabrication Process

Imaging desired layout on copper clad laminates
Etching or removing excess copper from inner layers to reveal traces and pads
Creating the PCB layer stackup by laminating (heating and pressing) board materials at high temperatures
Drilling holes for mounting holes, through hole pins and vias
Etching or removing excess copper from the surface layer(s) to reveal traces and pads
Plating pin holes and via holes
Adding protective coating to surface or solder masking
Silkscreen printing reference and polarity indicators, logos or other markings on the surface
Optionally, a finish may be added to copper areas of surface

5.PCB Pictures

30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard