Происхождение: | Китай |
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Название марки: | схема KAZ |
Сертификация: | ISO9001, TS16949, UL, RoHS |
Модель: | РСБА - S - 00201 |
Минимальное количество заказов: | Один. |
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Цены: | Доллар США / шт. |
Детали упаковки: | Упаковка пузырьков |
Время поставки: | 2 - 3 недели |
Условия оплаты: | T / T, Western Union Переводы, Paypal |
Потенциал предложения: | 20 000 м2 / месяц |
Categary: | PCBA Design | Material: | FR-4 |
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Layers: | 8 Layers | Board Thickness: | 1.6mm |
Copper: | 1 Oz | Surface: | ENIG |
High Light: | pcb board design, electronic board design |
HDI Printed Circuit Board Assembly 8 Layers with impedance control
Detail Specifications:
Layers | 8 Layers |
Material | FR-4 |
Board Thickness | 1.6 mm |
Copper Thickness | 1oz |
Surface Treatment | ENIG |
Soldmask & Silkscreen | Green |
Quality Standard | IPC Class 2, 100% E-testing |
Certificates | TS16949, ISO9001, UL, RoHS |
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
Capacity |
Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
Board Thickness | 0.3~4.0mm |
Layers | 1~20 layers |
Material | FR-4, Aluminum, PI |
Copper Thickness | 0.5~4oz |
Material Tg | Tg140~Tg170 |
Max PCB Size | 600*1200mm |
Min Hole Size | 0.2mm (+/- 0.025) |
Surface Treatment | HASL, ENIG, OSP |
SMT Capacity
Photoes of this HDI Printed Circuit Board Assembly 8 Layers For Mobile Phone Cell Phone with impedance control