Компоненты печатных плат HDI 8 слоев с управлением сопротивлением

Подробная информация о продукции:

Происхождение: Китай
Название марки: схема KAZ
Сертификация: ISO9001, TS16949, UL, RoHS
Модель: РСБА - S - 00201

Условия оплаты и перевозки:

Минимальное количество заказов: Один.
Цены: Доллар США / шт.
Детали упаковки: Упаковка пузырьков
Время поставки: 2 - 3 недели
Условия оплаты: T / T, Western Union Переводы, Paypal
Потенциал предложения: 20 000 м2 / месяц


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Общий обзор

Detailed Product Description
Categary: PCBA Design Material: FR-4
Layers: 8 Layers Board Thickness: 1.6mm
Copper: 1 Oz Surface: ENIG
High Light: pcb board design, electronic board design


HDI Printed Circuit Board Assembly 8 Layers with impedance control


 
Detail Specifications:

 Layers  8 Layers
 Material  FR-4
 Board Thickness  1.6 mm
 Copper Thickness  1oz
 Surface Treatment  ENIG
 Soldmask & Silkscreen  Green
 Quality Standard  IPC Class 2, 100% E-testing
 Certificates  TS16949, ISO9001, UL, RoHS

 

What KAZ Circuit can do for you:

  • PCB&PCBA design
  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)


Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
  

Manufacturer Capacity:

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP

 

SMT Capacity

HDI Printed Circuit Board Assembly 8 Layers with impedance control
 

Photoes of this HDI Printed Circuit Board Assembly 8 Layers For Mobile Phone Cell Phone with impedance control

HDI Printed Circuit Board Assembly 8 Layers with impedance control