Detail Specifications: 

Layers	1~20 Layers
Material	FR-4, Aluminum, Copper Base
Board Thickness	0.3mm~4mm
Copper Thickness	0.5~4oz
Surface Treatment	HASL LF / ENIG / OSP etc.
Soldmask & Silkscreen	Green/Blue/Black/White/Yellow etc.
Quality Standard	IPC Class 2, 100% E-testing
Certificates	TS16949, ISO9001, UL, RoHS

What Kingsum Electronic Circuit can do for you: 

• PCB & PCBA Design
• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below: 

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

8, Automotive

9, Smart Home

10, Industrial Automation

11, Medical Devices

12, New Energy

And so on

Advantage Of PCB Assembly Service

• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test

Manufacturer Capacity: 

Capacity	Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month
Min Line Width/Gap	4/4 mil (1mil=0.0254mm)
Board Thickness	0.3~4.0mm
Layers	1~20 layers
Material	FR-4, Aluminum, PI
Copper Thickness	0.5~4oz
Material Tg	Tg140~Tg170
Max PCB Size	600*1200mm
Min Hole Size	0.2mm (+/- 0.025)
Surface Treatment	HASL, ENIG, OSP

SMT Capacity

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	0201, 0402, 0603, 0805, 1206 package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01mm
Assembly capacity	≥8 million piots/day
DIP capacity	6 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.