1. There are a large number of peak pulse currents in digital circuits, and the interference energy of ground network U=I*R, so it is particularly important to reduce the ground impedance. A large part of the so-called anti-interference is achieved by reducing the grounding impedance, so a large number of copper paving or complete ground plane can reduce the grounding impedance, thus enhancing the anti-interference ability of the system;

2. For the power supply, its transmission path includes the power supply path and the return path. The voltage drop of the entire transmission path U=I*R, and the lower the DC resistance R on the path, the lower the voltage drop. Therefore, a large amount of copper paving can reduce the DC resistance along the transmission path of the power supply, thus reducing its voltage drop and improving the transmission efficiency of the power supply.

3. For the backflow of the power supply, the grounding wire is connected with the copper paving, which can make the power supply find the shortest backflow path to the maximum extent, thus reducing the area of the power loop and improving the anti-interference ability of the system.

4. Protect and isolate important signals and high-speed signals by paving the floor.

5. Copper skin is able to spread heat, a large number of ground copper skin combined with the hole, can greatly improve the heat dissipation system. The processing of chip hot pad is a good reflection of heat dissipation through copper skin and hole.