1. It is better for the material to be formed at the supplier, instead of being processed after entering the factory

2. Some components should be considered as far as possible using the method of machining free

3. Cancel the base and use kink

4. The dispensing position is too much, time-consuming and costly materials, and the implementation of free dispensing or less dispensing

5. The fuse is inserted horizontally or vertically without the base, which can save manpower and solve the possibility of the base clamp becoming loose

6. All jumper requirements on PCB should be considered. AI can be used, and such components should not be arranged on MI lines

6.1. If the jumper is too long, you can consider the segmented layout (layout into two sections)

6.2. If the jumper is too thick, multi-strand connection can be considered

7. layout using a reasonable size, avoid "island" copper foil;

8. It is desirable that the Chip element be perpendicular to the direction through the furnace to reduce undesirable stresses in the process and minimize tin surface problems

8.1 Some components in the layout to consider the use of free processing, that is, the transistor lock to the heat sink, can be directly inserted, without Angle cutting and shaping

8.2 Taking the influence of tin furnace and manufacturing process into full consideration, it is suggested that it is necessary to add some auxiliary measures in layout, so as to minimize the use of connected beads in the secondary touch up project, reduce the problem of more tin and less tin, and avoid the secondary repair

9. You are advised to add white paint between pins of SMD parts to prevent short circuit between pins

10. White paint is recommended around AI components