30L FR4 SMT PCB组件7.0mm厚度无铅HASL 94v0标准

产品详细信息:

原产地: 中国
品牌名称: KAZ
认证: UL-ROHS
型号: KAZA-100

付款和运输条件:

最小订单数量: 1台
包装细节: 真空包装
交货时间: 3-14天
付款条件: 电汇、西联汇款、速汇金、信用证、承兑交单
供应能力: 2000平方米/月


联系我们

概述

Detailed Product Description
Layer Count: 2 ` 30 Layers Max Board Size: 600 Mm X 1200 Mm
Base Material For PCB: FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material Rang Of Finish Baords Thickness: 0.21-7.0mm
Minimum Line Width: 3mil (0.075mm) Minimum Line Space: 3mil (0.075mm)
Minimum Hole Diameter: 0.10 Mm E-Testing: 100% E-Testing (High Voltage Testing); Flying Probe Testing
High Light: 30L FR4 SMT PCB Assembly, SMT PCB Assembly 7.0mm Thickness, Lead Free HASL Pcb Prototype Board

Ultrafast PCB fabrication manufacturer, offering one-stop PCB manufacturing, PCB assembly, SMT stencil,cheap and good quality pcb smt assembly

 

1. Features


1. One Stop OEM Service, PCB manufacturing Made in Shenzhen of China

2. Manufactured by Gerber File and BOM List from Customer

3. FR4 Material, Meet 94V0 standard

4. SMT, DIP technology suport

5. Lead Free HASL, Environmental Protection

6. UL, CE, ROHS Compliant

7. Shipping By DHL,UPS, TNT, EMS or Customer requirement

 

2. PCB Technical capability

SMT Position accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-Solder Max. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-Solder Metal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fit Press range:0-50KN
Max. PCB size:800X600mm
Testing ICT,Probe flying,burn-in,function test,temperature cycling


 

3.PCB Manufacturing Process

  1. 1.1 Step 1 – The Design.
  2. 1.2 Step 2 – Printing the Design.
  3. 1.3 Step 3 – Creating the Substrate.
  4. 1.4 Step 4 – Printing the Inner Layers.
  5. 1.5 Step 5 – Ultraviolet Light.
  6. 1.6 Step 6 – Removing Unwanted Copper.
  7. 1.7 Step 7 – Inspection.
  8. 1.8 Step 8 – Laminating the Layers.

 

4.The PCB Fabrication Process

  • Imaging desired layout on copper clad laminates
  • Etching or removing excess copper from inner layers to reveal traces and pads
  • Creating the PCB layer stackup by laminating (heating and pressing) board materials at high temperatures
  • Drilling holes for mounting holes, through hole pins and vias
  • Etching or removing excess copper from the surface layer(s) to reveal traces and pads
  • Plating pin holes and via holes
  • Adding protective coating to surface or solder masking
  • Silkscreen printing reference and polarity indicators, logos or other markings on the surface
  • Optionally, a finish may be added to copper areas of surface

 

5.PCB Pictures

30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard