简介:
SMT PCB组装是指表面贴装技术,是一种将SMC/SMD(中文名为Chip Components)安装在印刷电路板表面或其他基板表面,通过回流焊或浸焊的方式进行溶解和组装的电路组装技术。实现了电子产品组装的高密度、高可靠性、小型化和低成本。
特征:
1.密度高、体积小、重量轻;
2、焊点可靠,抗震性强,焊点缺陷率低;
3.高频,减少电磁和射频的干扰;
4.易于实现自动化,提高生产效率。
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Layer | Board Material | Board Thickness | Surface Treatment | The Min Space | The Min Line Width | The Min Hole | Remarks | |
01 | 6L | FR4-TG170 | 1.6MM | Immersion Gold 3U" | 4mil | 4mil | 8mil | |
02 | 6L | FR4-TG170 | 1.6MM | Immersion Gold 3U" | 4mil | 4mil | 8mil | |
03 | 8L | FR4-TG170 | 1.6MM | Immersion Gold 2U" | 4mil | 4mil | 8mil | |
04 | 6L | FR4 | 1.6MM | ENIG | 3mil | 4mil | 0.2mil |
Solermask Bridge3mil Laser Drilling 0.1mm |
05 | 4L | ROGERS+FR4混压 | 1.0MM | Immersion Gold 2U" | 4mil | 4mil | 8mil | High Frequency & Mixed Plating |
06 | 6L | FR4 | 1.6MM | OSP+Gold Finger | 4mil | 4mil | 0.25mil | Depth Control Holes |
07 | 12L | FR4 | 2.0MM | ENIG | 3mil | 3mil | 0.2mil |
Laser Drilling 0.1mm Impedance Control |
08 | 14L | FR4-TG170 | 8MM | Plating thick gold 3U" | 4mil | 4mil | 8mil | Half Hole Board |
09 | 4L | FR4-TG170 | 1.6MM | Immersion Gold | 4mil | 4mil | 8mil | High Frequency & Mixed Plating |